FA介紹
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非破壞性失效分析
外觀檢查
X-Ray
SAT
SEM EDS
Curve tracer(IV)
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破壞性失效分析
Cross section
Decapsulation
Crater test
IMC
RA介紹
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封裝相關可靠性驗證:是用于材料或封裝制程相關失效機制的驗證。試驗項目主要有環境應力測試和其他測試。
一.環境應力測試:1. MSL /Preconditioning
2. High Temperature Storage(HTS)
3. Temperature Humidity bias(THB) 4. Highly Accelerated Temperature and Humidity Stress(HAST)
5. Temperature Cycling(TC)
6. Unbiased Temperature/Humidity (Unbiased HAST)-uHAST
7. Unbiased Temperature/Humidity (Autoclave)-PCT -
二.其他測試:1. Solderability
2. 單臂跌落測試
3. 雙滾筒跌落測試
4. 震動測試
5. Solder Ball Shear
6. Wire Pull Strength
7. Bond ball shear